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AI data centers · Liquid cooling

Liquid-cooled
load banks
for AI.

AI data centers run power densities that air can no longer cool — 40 kW to over 130 kW per rack — served by direct-to-chip liquid cooling and coolant distribution units (CDUs). Before the GPUs go in, that liquid-cooling loop and its power train have to be proven under real, sustained thermal load.

Built for high-density AI

Prove the cooling
before the GPUs
arrive.

AI data centers run power densities that air can no longer cool — 40 kW to over 130 kW per rack — served by direct-to-chip liquid cooling and coolant distribution units (CDUs). Before the GPUs go in, that liquid-cooling loop and its power train have to be proven under real, sustained thermal load.

Ashford's liquid-cooled load banks simulate that load: precise, controllable heat rejected to the facility water or the CDU, at the flow rates and temperatures a live AI hall runs. They let commissioning teams validate CDUs, manifolds, pumps and the electrical chain at full density — safely, repeatably, before a single accelerator is installed.

  • Direct-to-chip / CDU load simulation for high-density GPU racks
  • Precise, controllable thermal load with tight temperature control
  • Heat rejected to facility water or coolant loop — low noise, compact
  • MW-class capacity for full white-space and power-train commissioning

Liquid-cooled commissioning

The category, built early.

01

Direct-to-Chip / CDU

Applies load through the liquid loop the way live AI hardware does — validating CDUs, manifolds and pumps.

02

Precise Temperature Control

Controllable, repeatable thermal load at the flow and temperature setpoints of a real AI hall.

03

Rack-Density Ready

Simulates 40 kW to 130 kW+ per rack — the densities air cooling cannot reach.

04

Full-Chain Validation

Prove the cooling loop and the electrical power train together, before the GPUs arrive.

Quotation within 24 hours

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FAQ

Common questions.

What is a liquid-cooled load bank and why do AI data centers need one?
A liquid-cooled load bank rejects its heat into a water or coolant loop instead of the air, so it can simulate the very high power densities of AI GPU racks. AI data centers use them to commission and prove direct-to-chip cooling, CDUs and the power train at full density before installing expensive accelerators.
What is direct-to-chip / CDU load testing?
Direct-to-chip cooling pipes liquid to the chip; a coolant distribution unit (CDU) manages that loop. A liquid-cooled load bank applies a controllable thermal load to that loop so teams can verify flow, temperature and the CDU under sustained full load during commissioning.
How much heat per rack can a liquid-cooled load bank simulate?
Ashford liquid-cooled load banks simulate the high-density loads of modern AI racks — from about 40 kW to over 130 kW per rack — at controllable temperatures, scaling to MW-class for full white-space commissioning.