AI data centers · Liquid cooling
Liquid-cooled
load banks
for AI.
AI data centers run power densities that air can no longer cool — 40 kW to over 130 kW per rack — served by direct-to-chip liquid cooling and coolant distribution units (CDUs). Before the GPUs go in, that liquid-cooling loop and its power train have to be proven under real, sustained thermal load.
Built for high-density AI
Prove the cooling
before the GPUs
arrive.
AI data centers run power densities that air can no longer cool — 40 kW to over 130 kW per rack — served by direct-to-chip liquid cooling and coolant distribution units (CDUs). Before the GPUs go in, that liquid-cooling loop and its power train have to be proven under real, sustained thermal load.
Ashford's liquid-cooled load banks simulate that load: precise, controllable heat rejected to the facility water or the CDU, at the flow rates and temperatures a live AI hall runs. They let commissioning teams validate CDUs, manifolds, pumps and the electrical chain at full density — safely, repeatably, before a single accelerator is installed.
- Direct-to-chip / CDU load simulation for high-density GPU racks
- Precise, controllable thermal load with tight temperature control
- Heat rejected to facility water or coolant loop — low noise, compact
- MW-class capacity for full white-space and power-train commissioning
Liquid-cooled commissioning
The category, built early.
Direct-to-Chip / CDU
Applies load through the liquid loop the way live AI hardware does — validating CDUs, manifolds and pumps.
Precise Temperature Control
Controllable, repeatable thermal load at the flow and temperature setpoints of a real AI hall.
Rack-Density Ready
Simulates 40 kW to 130 kW+ per rack — the densities air cooling cannot reach.
Full-Chain Validation
Prove the cooling loop and the electrical power train together, before the GPUs arrive.
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